The Internet of Things (IoT) is an important application scenario that promotes the development of SiP packaging technology, and wearable devices are a field with great application potential for system-in-package technology in the future.
The fingerprint recognition sensor, 3D face recognition sensor, WiFi wireless network and other functional modules are packed together, which is the use of system-in-package module technology.
There are two development paths for advanced packaging to take into account the approach to low cost, high reliability and large-scale integration of semiconductor devices. One is to reduce the size to make close to the chip size. An important indicator is the ratio of chip to package area. The closer this ratio is to 1, the better, including WL CSP, FC, Bumping Fanout, ets. The second is functional development, which emphasizes heterogeneous integration and provides multifunctionality in system miniaturization, including TSV, SiP and so on. The chip packaging technologies by year and future solutions.
Author(s) Details:
Konstantin O. Petrosyants,
National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Moscow, Russia and Institute for Design Problems in Microelectronics, Russian Academy of Sciences, Moscow, Russia.
Nikita I. Ryabov,
National Research University Higher School of Economics (Moscow Institute of Electronics and Mathematics), Moscow, Russia.
